DUE TO LOW REGISTRATIONS, THIS EVENT HAS BEEN CANCELLED!
ITAC SMCouncil Best Practice Forum
“Today’s Electronic Failure Analyses For Tomorrow’s Market Success”
The electronics and microelectronics industry is constantly evolving to meet market needs. This unbridled development of new products brings significant technical and economic challenges to the industry. Performance issues, customer returns, or problems with raw materials must be resolved quickly to maintain customer confidence and a certain profit margin. The resolution of these challenges often require highly specialized technical support, which may seem expensive at first sight, but is often a wise investment.
During this presentation, two case studies are presented to demonstrate the value-added of laboratory investigations, and the importance of the choice of analytical methods as well as the expertise of investigation team. For the first case study, several surface analysis techniques (SEM, TOF-SIMS, XPS) were used to identify contamination, visually invisible, responsible of a quality problem during development of a new product. The investigation methodology, knowledge of the strengths and weaknesses of techniques, and a collaborative work with the supplier have allowed the identification of the nature and root-cause of this contamination. For the second case study, an electrical failure has required the use of several techniques (Plasma FIB, 3D X-Ray, image analyzer …) and various fields of expertise (electric, chemical and metallurgical) to identify the failure mechanism and the factors responsible of this failure. This example illustrates the complementarity of the various analytical techniques and skills through a process of problem solving. Seating is limited. Please register early.
- Vincent Fortin, Vice president C2MI – MiQro Innovation Collaborative Centre
- Stéphane Laforte, Eng., M.Sc.A., IBM (Bromont)
- Luc Patry, M.SC.A., IBM (Bromont)
- $50.00 + HST – ITAC Members
- $70.00 + HST – Non-Members
|Date:||Tuesday, June 17, 2014||Wednesday, June 18, 2014|
|Time:||5:30 p.m. to 8:00 p.m.||5:30 p.m. to 8:00 p.m.|
1 City Centre Drive
25 Eddy Street
Biographies of the presenters
|Vincent Fortin, Eng., M.A.Sc.Mr.Vincent Fortin joined the MiQro Innovation Collaborative Center (C2MI) in 2012 as Vice-President, Business Development to lay out the strategy for establishing new industrial partnerships in all areas surrounding the fabrication of advanced semiconductor packaging, MEMS and microsystems. Prior to joining the C2MI, Vincent had been working at Teledyne DALSA where he held the position of Sales Manager from 2008 to 2012. His responsibilities were to ensure the growth of the MEMS foundry business as well as to manage strategic MEMS customer accounts. From 2003 to 2008, Vincent was managing MEMS customer development projects at Teledyne DALSA. Vincent also previously held various process engineering and project management positions in the semiconductor industry at Mosel Vitelic, Novellus Systems and Mitel. Vincent received his B.Eng. and M.A.Sc. degrees both in Engineering Physics from École Polytechnique de Montréal.|
|Stéphane Laforte, Eng., M.Sc.A.Stéphane Laforte received in 2007 a Baccalaureate and a Master degree in Physics Engineering from École Polytechnique de Montréal, specialized in micro-nanotechnologies and laser modifications of micro-electronic circuits. He works since 2007 for IBM in the Bromont Analytical Laboratory Services group where he supports problem solving teams and does failure analysis for IBM chip packaging sector. Stéphane Laforte is a member of Sematech Package and Interconnect Failure Analysis Council and he is now specialized in X-ray imaging, more particularly in the Hi-Resolution Xray tomography technique.Since 2012, He is situated at the C2MI research center where he works on several production and development projects, including collaboration projects with partners of C2MI.|
|Luc Patry, M.SC.A.Baccalaureate in Physics Engineering and a Master degree (Electronic Spectroscopy of Metal/Semiconductor III/V interfaces) in Physics from Université LavalProfessional Scientist in Laboratory of Surface Analysis , Université Laval (XPS, Auger, SIMS) R&D Scientist at Bomem (ABB) : conception, integration and test of space instrument (European satellite ENVISAT). He works since 1998 for IBM in the Bromont Analytical Laboratory Services group: failure analysis and material characterization.|
Hope to see you on June 17th or 18th!