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Fourth Annual ITAC/Global Semiconductor Alliance Forum

The New Normal: Navigating a World of Change, Globalization and Scarcity

A Strategic Microelectronics Council of ITAC Event

The world just keeps getting more and more complex - especially in the microelectronics industry.  The pace of technological change is increasing, new markets are opening in unexpected spaces and places and competitors are lurking in virtually every corner of the globe.  Executives in our industry must master the persistent demands for innovation in a context characterized by scarcity - scarcity of talent, time and cash. How will your organisation adapt to a world that seems to be expanding and contracting at the same time?

Technology continues to evolve and to present new and exciting opportunities for innovative products and new cost paradigms. For example, organic semiconductors offer the promise of "printed electronics", in ground-breaking flexible form factors and reconfigurable user profiles.

This year's Forum will provide an opportunity for representatives of companies from all parts of the fabless value chain to jointly discuss issues and directions that can make or break tomorrow's business models.

Please register now and join us as speakers from an array of leading global enterprises share their knowledge on today's opportunities and challenges as "The New Normal" impacts all aspects of our businesses and our professional lives.

Date Tuesday, April 20, 2010
Wednesday, April 21, 2010
Location Holiday Inn Burlington Hotel and Conference Centre
3063 South Service Road, Burlington, Ontario  L7N 3E9
(905) 639-4444

Co-Hosted by:
DALSA Corporation and GLOBALFOUNDRIES

Tuesday, April 20, 2010

Burlington, Ontario, Canada

Time Program
11:00 a.m. Registration
12:00 p.m. Bus leaves from Holiday Inn Burlington Hotel & Conference Centre for Xerox
12:30 p.m. Welcome and Opening Remarks

David Lynch, VP & GM, Media Processors Group, Sigma Designs Inc. and Chair, ITAC’s Strategic Microelectronics Council
Lisa Tafoya, Vice President, Global Semiconductor Alliance (GSA)
12:45 p.m. Lunch
1:30 p.m. Tour of Xerox Research Centre of Canada

The Xerox Research Centre of Canada is located in Mississauga and is one of four Xerox research centers around the world. XRCC is Xerox's materials research center, focusing on design and development of advanced materials such as next generation of toners, inks, photo-receptors, smart media and advanced materials for digital document media such as organic electronics.
3:00 p.m. Bus leaves Xerox Research Centre of Canada for Sound Design Wafer Fab
3:30 p.m. Tour of the Sound Design Wafer Fab

Sound Design Technologies Ltd is a leading designer and manufacturer of ultra-low power semiconductor solutions for hearing instruments, and a leading provider of advanced high density interconnect technologies used in custom miniaturized 3D Multi-Chip Modules (MCM), System-In-Package (SIP) and Stacked Chip Scale Packages (S-CSP). Sound Design Technologies' internal manufacturing and test capabilities service their Hearing Products and provide contract manufacturing for customers requiring ultra miniature System in Package (SiP) stacked devices.
5:00 p.m. Bus leaves Sound Design Wafer Fab for Holiday Inn Burlington Hotel & Conference Centre
5:30 p.m. Networking Reception at Holiday Inn Burlington Hotel & Conference Centre – Sponsored by PMC-Sierra
6:30 p.m. ITAC Board of Governors Dinner
(This dinner may not be included in conference registration fee depending on which option you selected at registration)

“The New Normal: International Trade with BRIC Countries”
Peter Harder, Canada China Business Council

The results of the Canadian Government’s study on the new international trading partnerships after the world’s first global recession.

Wednesday, April 21, 2010

Holiday Inn Burlington Hotel & Conference Centre, Burlington, Ontario, Canada

Time Program
8:00 a.m. Registration and Continental Breakfast
8:30 a.m. Welcome and Opening Remarks

David Lynch, VP & GM, Media Processors Group, Sigma Designs Inc. and Chair, ITAC's Strategic Microelectronics Council
Lisa Tafoya, Vice President, Global Semiconductor Alliance (GSA)
9:00 a.m. Keynote Address: "The New Normal - the world economy post global recession"

The global landscape has been changed irrevocably by the first, truly global recession, but concerted efforts by governments around the world have averted disaster and a fragile recovery is in progress. But, when the world's economy rebounds, it will be different and all companies and governments will have to address "The New Normal".

Bill Wiseman, Principal of McKinsey & Company
9:45 a.m. Keynote Address: Building a Successful Business in China: A Decade of Lessons Learned!

DALSA has been growing a successful business in China for over a decade. But what were the original reasons for being in China? How did DALSA get started and what did DALSA do to grow the business there? What were the lessons learned and what is the outlook for China?

Dr. Gareth Ingram, Vice President and General Manager, DALSA Digital Imaging
10:30 a.m. Networking Break
11:00 a.m. Panel Discussion: "How does running a company in the New Normal change Key Success Indicators?"

This panel of senior industry executives share their thoughts on the changing landscape which is driving new strategies and new demands for "out of the box" thinking.
 
Panelists include:
Colin Harris, COO, PMC-Sierra
Indra Laksono, Chief Technology Office, ViXS Systems
Angela Neill, VP Software Engineering, Advanced Micro Devices (AMD)
Paul Smith, Laboratory Manager, Xerox Research Centre of Canada

Moderator:
David Lynch, Senior VP, Marketing & Sales, Sigma Designs Inc.
Noon Lunch
1:00 p.m. Keynote: Managing Interdependencies in the Semiconductor Ecosystem

Semiconductor companies are increasingly dependent on partners in their ecosystem. Over the past year, The Wharton School (University of Pennsylvania) and GSA have surveyed and interviewed numerous participants in the semiconductor industry. The aim has been to understand the nature of coordination and technical challenges that companies face in creating and capturing value within their business ecosystem, so as to guide industry and firm-level initiatives. This presentation will give an overview of the preliminary results from this study, primarily from the fabless perspective.

Lisa Tafoya, Vice President, Global Semicondouctor Alliance (GSA)
1:45 p.m. Panel Discussion: "Sourcing Strategies: One-stop shopping or Best-of-Breed?"

Close supplier - customer relationships can be a great competitive advantage to your business when everything is running smoothly but an anchor around your neck when a storm rocks your boat. Can a sole source always hold you hostage or are there ways of defining a win-win scenario?

Panelists include:
Norm Armour, Vice President and General Manager, Fab 8, GLOBALFOUNDRIES
Paul Kempf, Vice-President, Silicon, Research In Motion
Sam Ho, President and CEO, DA-Integrated
Hari Subramaniam, VP Operations, Gennum Corporation

Moderator:
Lino Casalino, Advisory Services, PricewaterhouseCoopers LLP
2:45 p.m. Keynote Address: "Beyond Cell Phones and Computers - the Consumer Electronics Revolution!"

What changes will people face in their everyday lives that will drive consumer spending and create new businesses? Radio, Television, Mobile phones, the Internet - all these capabilities impacted the developed world, but what will the BRIC markets demand and who is best positioned to deliver value?

Steve Koenig, Director, Industry Analysis, Consumer Electronics Association (CEA)
3:45 p.m. Closing Remarks

Bernard Courtois, President and CEO, ITAC

This conference agenda is subject to change without notice. Return to this page for updates.

Speakers

Norm ArmourNorm Armour

Norm Armour has overall responsibility for the development and execution of Fab 8, a new 300mm semiconductor wafer fab being developed by GLOBALFOUNDRIES at the Luther Forest Technology Campus (LFTC) in upstate New York. In this role, Armour manages the site’s overall strategic direction and focus on maximizing efficiency and agility to ensure Fab 8 meets or exceeds expectations for operations and customer-service for a world-class semiconductor foundry.

Prior to GLOBALFOUNDRIES, Armour served as vice president of fab consulting at Applied Materials, where he led a team of subject matter experts who provided consulting services to customers in the areas of fab productivity/yield, factory systems, and environmental services. Before that, Armour was vice president and general manager for LSI Logic’s Gresham operations, where he successfully ramped the green field start-up into high-volume manufacturing and achieved best-in-class factory systems and metrics in cycle time, line yield, defect density, and ASIC/SOC die cost. Armour also spent six years at AMD as director of operations first at Fab 10 and then Fab 25, and participated in the initial programming of our Dresden operations.

Armour holds a bachelor’s degree in chemistry from Southern Methodist University in Texas.


Lino CasalinoLino Casalino

Lino Casalino is a Partner in the Performance Improvement practice of PricewaterhouseCoopers Consulting in Toronto where he leads the national procurement and supply chain team.

Lino has over 23 years of experience in the areas of cost reduction, performance improvement and technology implementation across a variety of sectors including retail, consumer packaged goods, electronics/technology, pharmaceuticals, industrial products and public sector. He has helped organizations develop new supply chain strategies, assess and implement outsourcing options, improve efficiencies and manage supply chain risk.

He holds a bachelor of Applied Science and Engineering from the University of Toronto and a Masters in Business Administration from the University of Georgia. He is a Professional Engineer of Ontario and a Certified Management Consultant of Ontario.


Bernard CourtoisBernard Courtois

As the President and CEO of ITAC, the Information Technology Association of Canada, Bernard Courtois is an outspoken advocate for the deployment of information and communications technology tools to improve business productivity and to achieve our societal and public policy goals.

Mr. Courtois was named ITAC's leader in January 2004. He is a lawyer with over 30 years experience in the telecommunications sector. He served in a variety of executive roles with Bell Canada from 1991 to 2003, including those of Chief Regulatory Officer and Chief Strategy Officer. Prior to joining Bell Canada, Mr. Courtois practiced law in Montreal and Ottawa serving a wide range of clients in telecommunications and other regulated industries. He was an active participant in the many regulatory, public policy and judicial proceedings which have shaped Canada's competitive communications marketplace. He was Chief Strategy Officer when Bell Canada took its strong turn to the Internet, ahead of most of its peers around the world.

Mr. Courtois is also a dedicated and energetic builder of business communities. He has served on the ITAC Board of Directors since 1999. He has also served on the executive of the Canadian Chamber of Commerce; was President of the International Institute of Communications and now serves on its Board of Directors; is Director and Treasurer of the National Gallery of Canada Foundation; is a Director of the Rideau Club; serves on the Telecommunications Hall of Fame Foundation Board of Governors; Kids’ Internet Safety Alliance’s (KINSA) Board of Directors; is a Director and Vice-Chair for North America of the World Information Technology and Services Alliance; and is Chairman of WCIT 2012 Montréal Inc.


Peter HarderPeter Harder

Peter is Senior Policy Advisor to Fraser Milner Casgrain LLP. Peter possesses a wealth of expertise in public policy as a result of his involvement at the centre of government decision making for over thirty years.

Prior to joining FMC, Peter was a long serving Deputy Minister in the Government of Canada. First appointed a Deputy Minister in 1991, he served as the most senior public servant in a number of federal departments including Treasury Board, Solicitor General, Citizenship and Immigration, Industry and Foreign Affairs and International Trade. At Foreign Affairs, Peter assumed the responsibilities of the Personal Representative of the Prime Minister to three G8 Summits (Sea Island, Gleneagles and St. Petersburg).

In 2000, the Governor General presented Peter with the Prime Minister’s Outstanding Achievement Award for public service leadership. In 2002, Peter was awarded the Queen Elizabeth II Jubilee Medal for public service. And in 2007, the President of Colombia named Peter grand master of the Order of San Carlos for his contribution to international relations.

Peter has joined the Boards of Power Financial Corporation, IGM Financial Corporation, ARISE Technologies, Telesat Canada, Energizer Resources, KRIA Resources Inc. and Pinetree Capital Limited. Peter is also a member of a Board of Governors of the University of Ottawa, The United Church Foundation, The Commonwealth Games Foundation of Canada, Canada World Youth, and The National Police Services Advisory Council (RCMP). Since 2008, he also serves as an independent advisor to the Auditor General of Canada.

Mr. Harder was appointed a Trudeau Foundation Mentor for 2009-2010. He also serves as the Chair of the National Arts Centre’s Governance, Nominating, and Ethics Committee. In 2008, Peter was elected the President of the Canada China Business Council (CCBC). He also serves on the Board of Directors of the Canada Eurasia Russia Business Association (CERBA) and is a member of the International Institute for Strategic Studies (IISS).

Peter is a Jury member for the Donner Book Prize, and is a regular television and print commentator.


Colin HarrisColin Harris

Colin Harris is Chief Operating Officer of PMC-Sierra. He is responsible for all aspects of worldwide manufacturing including supplier relationships, product testing and assembly. Mr. Harris also oversees quality and reliability, product engineering, and design services. Previously, he also held the position of Vice President and General Manager of the Communication Products Division. Prior to that he was Vice President of IC Technology and was responsible for developing the Company's computer-aided design, physical design, and quality organizations into Best-In-Class groups delivering semiconductor solutions.

Mr. Harris joined PMC-Sierra (formerly a division of MPR Teltech) as Operations Manager in 1989. In 1992, he was promoted to Director of Operations and subsequently Director of Quality Assurance. Mr. Harris began his career as a Product Engineer in wafer operations at Mitel Semiconductor in 1980 and went on to hold several engineering positions including Manager of IC Design.

Mr. Harris is a member of the Global Semiconductor Alliance (GSA) Board of Directors. He also serves on the advisory board of the Design for E-Beam (DFEB) initiative and is Chairman of the Board at Redlen Technologies, a start-up company. He was Chairman of the FSA Standard Foundry Process Qualification (SFPQ) Committee whose work became the basis for the joint FSA/Jedec publication JP-001 for foundry qualification. Currently, Mr. Harris holds five patents relating to microchips.

Mr. Harris received a Bachelor’s degree in Engineering Physics from the University of British Columbia in 1980.


Sam HoSam Ho

Sam has more than 40 years experience in the semiconductor industry dating back to Senior Management roles at the Canadian Development Division of Control Data Corporation. During the maturation of the semiconductor industry through the 80’s and 90’s, Sam held highly influential roles at Nortel’s Semiconductor Component Group in Ottawa and then ATI Technologies Inc. in Toronto.

In 2002, as the dotcom downturn came upon us, Sam perceived a discontinuity in the semiconductor tools and services industry and used the opportunity to found DA-Test Inc.

The company has taken a unique and innovative approach to growing the business. Starting as a pure-play test solution provider, it has evolved into a multi-domain service company covering the entire value-chain from design to manufacturing. With services ranging from turnkey IC design to production testing, it is well position to become a global player in the microelectronics development services industry. The company is rebranded as DA-Integrated with customer world wide including some of the top 10 semiconductor companies, many fabless and system companies.

Sam holds a B. A. Sc. from U. of Waterloo.


Dr. Gareth IngramDr. Gareth Ingram

Dr. Ingram (B.Sc., M.Sc., Ph.D.) obtained his Ph.D. in Engineering Physics from Oxford University in 1998 and went on to spend a year at the IBM T. J. Watson Research Centre in New York. On returning to the UK he joined GEC Marconi Ltd. and was seconded to the Cavendish Laboratories at Cambridge University. In 1994 he became Group Leader at the Marconi R&D Laboratories in London before moving to Canada in 1995 to join DALSA Inc. At DALSA he became the leader of the Application Specific Contracts (ASC) group, being promoted to VP and General Manager in 2004 and in 2008 as VP and GM for both Standard (market driven) and Custom (customer funded) imaging products for the Waterloo, Ontario facility.


Paul KempfPaul Kempf

Paul Kempf is a semiconductor industry veteran who is currently Vice President at RIM, responsible for the silicon platform in the BlackBerry. In this role, he works with hardware and software teams to establish the IC roadmap for handheld products and deliver platform reference designs.

Before returning to Canada 2006, Paul helped create California-based Jazz Semiconductor, where he was Chief Technology Officer responsible for Engineering, Marketing, Quality and the Jazz Shanghai Subsidiary. Prior to Jazz, he was Vice President of the Silicon RF Platform group at Conexant Systems in Newport Beach and held several management positions with Rockwell Semiconductor Systems prior to the Conexant spin-off. The formative stage of his career was spent with Nortel in Ottawa developing custom silicon.

Mr. Kempf holds bachelor and master degrees in engineering physics from McMaster University in Canada.


Steve KoenigSteve Koenig

Steve Koenig is the Director of Industry Analysis at the Consumer Electronics Association (CEA). As a part of CEA’s market research team, Koenig directs the Market Activity Report and Analysis Program (MARA), which tracks factory shipments of consumer electronics (CE) products to U.S. dealers, and oversees the semi-annual CE Industry Forecast.

Koenig’s other duties include development of consumer research initiatives; crafting analysis of CEA’s consumer research and shipment data and responding to member and media inquiries for both in-home and on-the-go CE technologies.

Koenig brings more than 15 years of analytical and writing experience within the CE industry to his position. Prior to joining CEA, he worked as an analytic consultant for comScore Media Metrix and earlier as technology industry analyst and account manager at The NPD Group/PC Data Inc. In addition, Koenig was a senior editor at CMP Media’s former Computer Retail Week, authoring news stories about imaging hardware and software, entertainment software and e-commerce. He also worked at ARS Inc. as a competitive analyst focused on the IT printer industry.

A native Texan, Koenig graduated from the University of North Texas in Denton, Texas, with a bachelor’s degree in marketing. He currently resides in Fairfax, VA.


Indra Laksono

Indra Laksono co-founded ViXS in 2001 and currently serves as Chief Technology Officer. Mr. Laksono has held various positions within ViXS, including overseeing Software Engineering, research and development, ASIC architecture and Application Development. Prior to founding ViXS, Mr. Laksono held a number of senior positions at ATI Technologies Inc. Mr. Laksono has filed over 60 patents, primarily in video processing and codecs. Mr. Laksono holds a Bachelor of Science degree in Computer Science and Math, and a Master of Science degree in Computer Science from University of Toronto.


David LynchDavid Lynch

David Lynch is currently Vice-President and General Manager Media Processors at Sigma Designs Inc with responsibility for all IPTV set top box, cable set top box, digital media adaptor, Blu-ray, VXP image processing and Z-Wave home control chip definition, product marketing, product development and integration engineering. He joined Sigma Designs in February 2008 as Vice-President of VXP Image Processing and established the new Canadian office for Sigma Designs. In September 2008, he was promoted to Vice-President of Sales and Marketing with worldwide responsibility for all Sigma sales and product marketing, and subsequently promoted to his current role in March 2010.

Between 1994 and 2008, Mr. Lynch held a number of roles at Gennum Corporation. He was Vice-President of Research and Development from April 1994 to June 2000. From June 2000 to August 2007, he was Vice-President and General Manager, Video Products Division with responsibility for all aspects of the video and broadcast IC business, including marketing and sales, product development and sourcing. In January 2007, Mr. Lynch assumed the additional responsibility of Chief Technical Officer for the Corporation and in August 2007, he was appointed Senior Vice-President and General Manager of the Image Processing Division.

David Lynch started in Bell-Northern Research in 1978 and held a variety of technical and management positions within both Bell-Northern and Northern Telecom culminating in global responsibility for all Nortel custom semiconductor design and tools. Over his career, Mr. Lynch has developed advanced expertise in integrated circuit development, including silicon design, silicon new product introduction, and research and development.

Mr. Lynch has been and continues to be actively involved with a number of industry associations, including the Information Technology Association of Canada (ITAC) where he is currently Chair of the Strategic Microelectronics Council. Additionally, he has authored a number of technical papers and holds a number of patents.


Dr. Paul SmithDr. Paul Smith

Dr. Smith joined Xerox in 1995 and has held a variety of managerial positions, including Manager, Advanced Materials and Manager Direct Marking Materials. He has led teams that developed materials for Xerox product platforms, including solid ink components and new inks for Xerox Phaser printers including the ColorQube. 

He is currently the Laboratory Manager, Materials Synthesis and Characterization at the Xerox Research Centre of Canada. 

Dr. Smith received his PhD in the field of Chemistry from the University of Bath, England in 1991, was an NSERC Fellow from 1995 to 1997, and in 2001 received an MBA from the Rotman School of Management, at the University of Toronto.

He is a named inventor on over 38 U.S, patents and has 16 publications.


Hari SubramaniamHari Subramaniam

Hari Subramaniam joined Gennum Corporation in 2004 as Manager, Test Operations and in January 2007 was appointed Director of Manufacturing & Test. In August 2007 he was promoted to Director of Operations and in February 2010 he was promoted to Vice President of Operations, where he is responsible for creating and sustaining a high efficiency fabless manufacturing operations team. Previously, Hari held several senior management positions with ST Microelectronics from 1990 to 2004. From 1982 to 1990 he was employed with Indian Telephone Industries Ltd. in Research and Development.

Hari holds a B.S. in Electronics & Communication Engineering from Kerala University, India and a Master of Business in Information Technology from the Royal Melbourne Institute of Technology, Australia.


Lisa TafoyaLisa Tafoya

Lisa Tafoya brings more than 19 years of experience in sales and marketing, communications and research to her role with GSA. Her in-depth ability to assess industry trends, create meaningful analysis and creatively promote various membership and research activities make her a valuable asset as the GSA's Vice President. In her role, Ms. Tafoya is responsible for North America and Europe membership responsibilities. Ms. Tafoya also performs the strategic planning and oversees the implementation of all GSA member reports, surveys and deliverables. She oversees all data collection and analysis, as well as global publications created and distributed by the Association.


Bill WisemanBill Wiseman

Bill is the Managing Partner of McKinsey’s Taipei office and co-leads the Firm’s Semiconductor Practice in Asia. Since joining the Firm in 2000, Bill has worked throughout the semiconductor value chain, serving a mix of IDMs, fabless, foundry, and capital equipment clients on topics of strategy and operations. His recent focus has been finding adjacent growth opportunities and new business models as the technology landscape continues to commoditize. His recent experience includes:

  • Devised and led strategic war games for several leading semiconductor companies; in each situation, senior executives were assigned to represent competitors or the company itself during the game, resulting in alignment amongst the top team on priority opportunities, weaknesses, and threats
  • Led the performance transformation of a top 10 semiconductor manufacturer, focusing on balancing their lean production system. The approach was holistic - Bill’s teams worked across wafer fabrication facilities, final manufacturing facilities, maintenance services, product design, and capital equipment procurement functions
    Transformed the manufacturing operations of a leading silicon memory manufacturer, increasing productive capacity from existing wafer fabrication facilities by 25% while cutting cycle time by 40%
  • Validated the strategy of a leading memory manufacturer, focusing on opportunities in consumer electronics and wireless products.
  • Helped a semiconductor manufacturer develop a product roadmap for the wireless device market and refine their value proposition with device OEMs and mobile operators
  • Redefined the semiconductor procurement roadmap for a top 5 wireless handset OEM with specific focus on memory and baseband processors

Prior to joining McKinsey, Bill was a Special Warfare officer in the US Navy from 1992 to 1998, leading several elite, 16-member special forces units at SEAL Team 5. As a SEAL Platoon Commander, he served as a military advisor to units in South Korea, Philippines, Malaysia, and Australia. Following his military service, Bill designed mixed-signal integrated circuits for IBM in Raleigh, NC.

Bill received a Master of Business Administration degree from the Fuqua School of Business at Duke University, a Master of Science in Electrical Engineering from North Carolina State University, and a Bachelor of Science in Systems Engineering from the U.S. Naval Academy.

Registration Fees
  ITAC/GSA Members Non-Members
Tours (April 20) and Conference (April 21) $275.00 Cdn + GST $350.00 Cdn + GST
Tours (April 20), Board of Governors Dinner (April 20) and Conference (April 21) $395.00 Cdn + GST $470.00 Cdn + GST

Hotel Reservations
A block of rooms being held for the event at the rate of $125.00 + taxes (Queen Bed - Non-Smoking / Standard). Check in time is 3:00 pm and checkout time is 12:00 noon. For those requesting a Late Check Out, a charge will be applied after 12:00 noon. To make a reservation, please contact the Reservations Coordinator at: (905) 639-4443 x 4676 or 1-888-987-4888 and quote the Block ID 504434 to make your reservation. Visit the Holiday Inn website for more details.

Co-host Sponsors

DALSA Corporation

DALSA Corporation is an international leader in high performance digital imaging and semiconductors with approximately 1000 employees world-wide. Established in 1980, the Company designs, develops, manufactures, and markets digital imaging products and solutions, in addition to providing semiconductor products and services. DALSA's core competencies are in specialized integrated circuit and electronics technology, software, and highly engineered semiconductor wafer processing.

DALSA's products and services include image sensor components (CCD and CMOS); electronic digital cameras; vision processors; image processing software; and semiconductor wafer foundry services for use in MEMS, high-voltage semiconductors, image sensors and mixed-signal CMOS chips. DALSA is listed on the Toronto Stock Exchange under the symbol "DSA" and has its corporate offices in Waterloo, Ontario, Canada.

GLOBALFOUNDRIES

GLOBALFOUNDRIES is the world's first full-service semiconductor foundry with a truly global manufacturing and technology footprint. Launched in March 2009 through a partnership between AMD [NYSE: AMD] and the Advanced Technology Investment Company (ATIC), GLOBALFOUNDRIES provides a unique combination of advanced technology, manufacturing excellence and global operations. With the integration of Chartered in January 2010, GLOBALFOUNDRIES significantly expanded its capacity and ability to provide best-in-class foundry services from mainstream to the leading edge. GLOBALFOUNDRIES is headquartered in Silicon Valley with manufacturing operations in Singapore, Germany, and a new leading-edge fab under construction in Saratoga County, New York. These sites are supported by a global network of R&D, design enablement, and customer support in Singapore, China, Taiwan, Japan, the United States, Germany, and the United Kingdom.

  • Reception Sponsor


    PMC-Sierra

  • Breakfast Sponsor


    Gennum

  • Networking Break


    CMC

  • Luncheon Sponsor


    IBM


Sponsorship Opportunities

Download the information package and sponsorship form

Sponsorship Levels

Sponsorship opportunities are available on a first come, first served basis. If your organization wishes to raise its profile with the microelectronics industry, you may wish to consider one or more of the following sponsorship options.


Co-host Sponsor (2 opportunities only) - SOLD - Cdn. $5,000 + GST

Benefits:

  • Opportunity to introduce keynote speakers or panelists in an insightful session
    (Where it is appropriate, the co-host sponsor may be invited to nominate a speaker,
    or participate as a panel member or speaker)
  • Top line visibility in all conference marketing and communications collateral
  • Maximum visibility during the conference as well as in all promotional and related materials
  • A banner with your logo on display as a backdrop to the podium throughout the entire conference
  • Inclusion of the co-host’s organizational profile on conference materials as well as Web site
  • Recognition on conference signage and in all conference materials
  • Two complimentary registrations to the conference
  • Logo on electronic mailings specific to the conference (when applicable)

Gold Sponsor - Cdn. $3,000 + GST

Benefits:

  • Opportunity to introduce keynote speakers or panelists in an insightful session
    (Where it is appropriate, the co-host sponsor may be invited to nominate a speaker,
    or participate as a panel member or speaker)
  • Prominent visibility in all marketing and communications material
  • Logo on conference material, as well as the conference Web site.
  • Recognition on conference signage and conference materials.
  • One complimentary registration to the conference
  • Logo on electronic mailings specific to the conference (when applicable)

Activity Sponsors

Continental Breakfast (Exclusive Opportunity) - $2,500 Cdn. $ + GST
Networking Break (am) - $1,500 Cdn. $ + GST
Luncheon (Exclusive Opportunity) - $3,500 Cdn. $ + GST
Reception (Exclusive Opportunity) - SOLD - $2,000 Cdn. $ + GST

Benefits:

  • Inclusion of your logo on event material as well as the conference Web site
  • Recognition as a sponsor for the specified activity on conference signage

Register for this event

Click here to Register Online

For more information contact: Micheline Levesque, E-mail: mlevesque@itac.ca at (613) 238-4822 x 245 or Cell: (613) 791-1261.

Co-host Sponsors

DALSA Global Foundries

Gold Sponsors

AMD RIM Sigma
ST Microelectronics