Fifth Annual ITAC/Global Semiconductor Alliance Forum: "The reality of 3D ICs – the leading driver for next Generation Microelectronics?"

11:00 a.m.

Registration in Lobby of Hyatt Regency

12:00 p.m.

Bus leaves from Hotel for NRC

12:30 p.m.

Welcome and Opening Remarks
Lynda Leonard, Vice President, ITAC
Wade Giles, Vice President, Global Semiconductor Alliance (GSA)

12:45 p.m.

Light Lunch at NRC

1:30 p.m.

Tour of NRC’s Industrial Materials Institute

NRC-IMI promotes the growth and competitiveness of Canadian industry through research and development in materials processing technologies and works with a wide variety of industry sectors to develop and improve technologies that meet the needs of 21st century consumers. This tour will include: Lab-on-a-chip manufacturing for rapid detection of pathogens; Functional Nanomaterials; Virtual Reality technologies for medical and industrial simulations; and non-destructive testing using optics and ultrasonics.

3:00 p.m.

Bus leaves NRC for McGill Institute

3:30 p.m.

Tour of the McGill Institute for Advanced Materials (MIAM)

MIAM was established to act as a focal point for research into advanced materials, nanoscience and nanotechnology and is jointly operated by the Faculties of Engineering and Science at McGill. MIAM operates laboratory facilities worth almost $20M, including nanofabrication and surface characterization equipment, and also helps to coordinate a wide range of different research activities and research training programs. MIAM members at McGill are leading advanced research across the spectrum of advanced materials, nanoscience and nanotechnology, and this tour will highlight some of their latest research. This will include research on nanoelectronics (including applications for quantum computing and the behaviour of nano-scale wires), nanophotonics (including microlasers and new photovoltaic materials) and DNA sensing using nanofluidic technologies, in addition to a tour of the MIAM nanofabrication facilities.

5:00 p.m.

Bus leaves McGill Institute for Hotel

5:30 p.m.

Networking Reception at Hotel – Sponsored by Mentor Graphics

With special appearance by Dennis Britten, one of the best professional guides in Montréal for 20 years.

Montréal has an important place in North American history but is a living, breathing “International Design City” with 3 distinct parts: “Vieux-historical”; “centre-ville-more modern”; and “Quartier International-in-between”. From its ocean port past to its “Green City” present; from its summer festivals (Quartier des Spectacles) to its storied sports culture, Montréal has lots to offer and Dennis has a lot of stories to share. So join us for excellent networking and set the scene for a memorable night in unique Montréal!”.

8:00 a.m.

Registration and Breakfast – Sponsored by ViXS Systems Inc.

8:30 a.m.

Welcome and Opening Remarks

Wade Giles, Vice President, Global Semiconductor Alliance (GSA)
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Introduced by
Ken Wagner, Chair, ITAC’s Strategic Microelectronics Council

9:00 a.m.

Keynote Address:
"3D ICs Importance as THE leading driver for Next Generation Microelectronics”

“Smaller, faster, cheaper – pick any two” used to be the mantra for electronics systems. Today’s consumers, however, now expect all three criteria to be met. Electronics systems companies have passed the problem on to their semiconductor suppliers. Will 3D ICs be the way that companies can deliver “smaller, faster and cheaper”, driving the semiconductor and electronics markets to new heights?”

Jordan Selburn, Principal Analyst, ASICs & PLDs, IHS iSuppli

9:45 a.m.

Keynote Address:
"Paradigm Shift - From 2D SOCs to 3-dimensional structures”

In the quest to provide ever smaller, faster, lower power, less expensive chip solutions, innovation has allowed nanoscale structures, new chip packaging with low inductance pins, a switch from SiGe and BI-CMOS to pure CMOS technologies. But, over the years huge investments were necessary to achieve these advances.

So, is there an appetite to launch 3D IC technology? Are the benefits worth the cost? Are all parts of the value chain embracing the new challenges? And, when can we expect these “miracle chips” if at all?

Herb Reiter, 3D IC Consultant, Global Semiconductor Alliance (GSA)

10:30 a.m.

Networking Break – Sponsored by CMC Microsystems

11:00 a.m.

Panel Discussion:
"The reality of 3D ICs"
This panel of senior industry executives from the supply chain share their thoughts on the manufacturing challenges and economics of 2D SoCs versus different 3D solutions and the timing of their likely adoption.
 Panel:

• Javier DeLa Cruz, Director, Manufacturing Technology, eSilicon

• Gary Fleeman, Director, Product Engineering, Advantest

• Don Kurelich, Technical Director, Sales - Americas, Mentor Graphics

• Remi Meingan, Design & Product Foundry Service Manager, Teledyne DALSA

Moderator: Jordan Selburn, Principal Analyst, ASICs & PLDs, IHS iSuppli

Noon

Lunch and Networking

1:15 p.m.

Keynote Address:
"3D IC benefits for Networking Applications"

3-D ICs are indeed popular in cell phone applications but are still very limited in Networking. New opportunities exist that could revolutionise photonics integration, and Si-photonics specifically. But other solutions are also possible to allow “More-than-Moore” product introductions.

Brian Gerson, VP R&D, PMC-Sierra

2:00 p.m.

Keynote Address:

“3D IC benefits for High Performance Computing”
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Memory technology and the memory business have been the engine that powered technological innovations in semiconductors especially lithography and innovative micro-structural engineering. While stand alone memory has been commoditized, when embedded in high performance logic, it provides incredible leverage for high performance processors, network and mobile appliances, and almost every application. This talk will explore memory in systems, especially DRAM; integration of deep trench technology into high performance logic; the value it brings, as well as the collateral advantages it has brought about in power management, noise decoupling, autonomic chip repair and its potential evolution into 3-dimensional chip technology. We will examine in detail the technology considerations for the implementation of 3D in a logic environment as well as extensions into wafer scale 3D integration.

Subramanian Iyer, Director & Chief Technologist, Semiconductor R&D Center, IBM

2:45 p.m.

Networking Break – Sponsored by CMC Microsystems

3:15 p.m.

Keynote Address:
“3D IC benefits for Mobile Computing”

Nobody said it would be easy – all they want is all the capabilities of their desktop computer in a device that they can carry around in just one hand – and it has to last forever without charging it – and it has to be a phone too! Many innovative technologies have come to the rescue to make today’s smart-phones so powerful and yet so small, but are 3D IC technology essential for the next leap in advanced capabilities? Are there alternatives? When can we expect to benefit from 3D ICs?

Paul Kempf, VP, Silicon, RIM

4:00 p.m.

Closing Remarks
Bernard Courtois, President and CEO, ITAC