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Fifth Annual ITAC/Global Semiconductor Alliance Forum: "The reality of 3D ICs – the leading driver for next Generation Microelectronics?"
Download the presentations
Wade Giles - Welcome and Opening Remarks
Herb Reiter - Paradigm Shift: From 2D SOCs to 3-dimensional structures
Brian Gerson - 3D benefits for Networking Applications
Collin Twanow - 3D benefits for MEMS Devices
April 28, 2011
Four Seasons Hotel, 791 West Georgia Street, Vancouver, BC V6C 2T4
A Strategic Microelectronics Council of ITAC Event
The emergence of new technologies have foreshadowed major revolutions in business models, driven not just by new capabilities, but by these new capabilities breaking through price barriers at which they can be adopted by consumers en mass – bipolar to CMOS; mixed signal CMOS; GaAs ICs.
In packaging technologies, the widespread adoption of the plastic Dual-in-Line package enabled mass produced consumer devices – starting with the pocket calculator!
There has been much discussion and debate on the “More Moore” trend and how we are rapidly approaching the time where this is no longer applicable to the semiconductor industry. In fact, the “More Moore” trend is unlikely to continue without significant technological intervention. So, will the advent of 3D ICs prove to be that technological intervention that will herald the continuation of “More Moore”? Will 3D IC/TSV remove roadblocks to higher system demands? The benefits of this design approach are obvious and will address end-customer demands for smarter, faster, lower power and lower cost ICs and systems. So, if 3D IC/TSV is the answer, when can we expect the industry to adopt this process and what resources, tools and support are needed to successfully integrate this design approach for future growth and profitability?
This year’s Forum will explore the opportunities available to the microelectronics community by taking advantage of this fundamental change. Leading world experts will share their knowledge and perspectives on the challenges affecting system design, architecture, supply-chain partnerships, cost structures and the impact this could have on end product capabilities and the bottom-line.
Please mark your calendars and register today so that you do not miss the networking and learning that could impact your organisation’s response to a fundamental change in your industry.
Program
Time |
Program |
|---|---|
1:00 p.m. |
Registration, coffee and dessert |
1:30 p.m. |
Welcome and Opening Remarks Introduced by |
2:00 p.m. |
Keynote Address: 3D ICs Importance as THE leading driver for Next Generation Microelectronics Gartner, Inc. (NYSE: IT) is the world’s leading information technology research and advisory company with 60,000 clients in 11,000 distinct organizations. Founded in 1979, Gartner is headquartered in Stamford, Connecticut, U.S.A., and has 4,400 associates, including 1,200 research analysts and consultants, and clients in 85 countries. Jim Walker, Analyst, Gartner (invited)
|
2:45 p.m. |
Keynote Address: Paradigm Shift - From 2D SOCs to 3-dimensional structures In the quest to provide ever smaller, faster, lower power, less expensive chip solutions, innovation has allowed nanoscale structures, new chip packaging with low inductance pins, a switch from SiGe and BI-CMOS to pure CMOS technologies. But, over the years huge investments were necessary to achieve these advances. So, is there an appetite to launch 3D IC technology? Are the benefits worth the cost? Are all parts of the value chain embracing the new challenges? And, when can we expect these “miracle chips” if at all? Herb Reiter, 3D IC Consultant, Global Semiconductor Alliance (GSA)
|
3:30 p.m. |
Networking Break |
4:00 p.m.
|
Keynote Address: 3D benefits for Networking Applications 3-D ICs are indeed popular in cell phone applications but are still very limited in Networking. New opportunities exist that could revolutionize photonics integration, and Si-photonics specifically. But other solutions are also possible to allow “More-than-Moore” product introductions. Brian Gerson, VP R&D, PMC-Sierra |
4:45 p.m. |
Keynote Address: Microelectromechanical Systems are increasingly combining multiple technologies but is 3D IC technology a threat or a springboard for next generation MEMS devices? Which end applications and new markets can be enabled by 3D IC technology? Nancy Fares, President and CEO, Micralyne |
5:30 p.m. |
Networking Reception |
6:30 p.m. |
Closing Remarks Wade Giles, Vice President, Global Semiconductor Alliance (GSA) |
This conference agenda is subject to change without notice. Return to this page for updates.
Speakers
Information coming soon.
Registration
Registration Fees | |
|---|---|
ITAC/GSA Members |
$175.00 + Taxes |
Non-Members |
$225.00 + Taxes |
Hotel Reservations
Four Seasons Hotel Vancouver
791 West George Street
Vancouver, British Columbia V6C 2T4
Tel: (604) 689-9333
www.fourseasons.com/vancouver/ (opens in new window)
Rooms are available at the rate of $195.00 + taxes. Your reservations can be made by calling reservations and mention the ITAC/GSA Event of April 28th, 2011.
Sponsorship Opportunities
For sponsorship information, please download the information package and sponsorship form (PDF - 147KB).
Register for this event
For more information contact Micheline Lepage by email at mlepage@itac.ca or by phone at (613) 238-4822 x 245.
Co-host Sponsors
Networking Break
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